JPH01162252U - - Google Patents
Info
- Publication number
- JPH01162252U JPH01162252U JP5438688U JP5438688U JPH01162252U JP H01162252 U JPH01162252 U JP H01162252U JP 5438688 U JP5438688 U JP 5438688U JP 5438688 U JP5438688 U JP 5438688U JP H01162252 U JPH01162252 U JP H01162252U
- Authority
- JP
- Japan
- Prior art keywords
- plating
- semi
- matte
- gloss
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5438688U JPH01162252U (en]) | 1988-04-22 | 1988-04-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5438688U JPH01162252U (en]) | 1988-04-22 | 1988-04-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01162252U true JPH01162252U (en]) | 1989-11-10 |
Family
ID=31280320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5438688U Pending JPH01162252U (en]) | 1988-04-22 | 1988-04-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01162252U (en]) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006303492A (ja) * | 2005-04-15 | 2006-11-02 | Samsung Techwin Co Ltd | 半導体パッケージ用のリードフレーム |
| JP2010080889A (ja) * | 2008-09-29 | 2010-04-08 | Sumitomo Metal Mining Co Ltd | リードフレーム及びその製造方法 |
-
1988
- 1988-04-22 JP JP5438688U patent/JPH01162252U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006303492A (ja) * | 2005-04-15 | 2006-11-02 | Samsung Techwin Co Ltd | 半導体パッケージ用のリードフレーム |
| JP2010080889A (ja) * | 2008-09-29 | 2010-04-08 | Sumitomo Metal Mining Co Ltd | リードフレーム及びその製造方法 |